Global Dicing Blade Market By Type (Hub Dicing Blades, and Hubless Dicing Blades), By Application (Semiconductors, Glass, Ceramics, and Crystals), By Region and Key Companies - Industry Segment Outlook, Market Assessment, Competition Scenario, Trends and Forecast 2019-2028

“Global Dicing Blade Market” is the title of an upcoming report offered by Market.US. This report on the dicing blade industry contains information and data, and inputs from both primary and secondary data sources, that have been verified and validated by experts in the target market. It also covers threats or challenges for existing as well as new entrants in the market. The report presents a thorough study of revenues, historical data, and information, key developments, and strategies by major players that offer vital insights and perspectives in to various scenarios market. Besides critical data and related information, the report includes key trends (both present and future), factors that are driving market growth, factors that are or could be potential restraints to market growth, as well as opportunities that can be leveraged for potential revenue generation in untapped regions and countries. The global dicing blade market has been segmented on the basis of product type, application, as well as regions and countries.

The Dicing Blade Market was valued at UЅD $299.0 Мn in 2020, and is projected to register а САGR of 3.5% over the next 10 years.

Overview:

A dicing blade is a blade that is connected to a saw to dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and several other types of materials.

Dynamics:

The exponential expansion of the semiconductor industry is leading to a surge in the demand for silicon and compound wafers, semiconductor packages, etc., and this is a primary factor that is expected to subsequently fuel the revenue growth of the global dicing blade market in the foreseeable future.

Moreover, the ongoing increase in the availability of dicing blades with different types of thicknesses, compositions, as well as coatings, is enabling end-users to choose from a broader spectrum of products, with which they can effective complete a designated task with ease, is another factor slated to positively impact the expansion of this global market in the coming years.

However, in light of the COVID-19 outbreak, the operations of key industry players have either been temporarily halted or are functioning with a minimal workforce. This is a factor that is expected to have a profound impact on the growth of this market in the coming years. Moreover, the dicing precision and speed of these blades is lower than that offered by laser dicing products, and this is also slated to negatively influence this market’s global footprint.

Nonetheless, the robust growth experienced by end-use industries such as glass and ceramics, who employ the extensive use of dicing blades for a list of increasing applications, is anticipated to boost the revenue growth of the global dicing blade market in the near future.

Segmentation of the global dicing blade market is as follows:

On the basis of product type, the hubless dicing blades segment accounted for the maximum number of revenue shares (60.4%) of the global dicing blade market in 2019, and is anticipated to index the highest CAGR over the forecast period. The hub dicing blades segment also accounted for considerable revenue shares of this global market in 2019, and is slated to continue to do so over the next 10 years.

In terms of application, the semiconductors segment accounted for the majority revenue shares of the global dicing blade market in 2019, and is projected to index the highest CAGR, with an attractiveness index of 6.4, over the forecast period. The ceramics segment accounted for a considerable number of revenue shares in 2020, and is indicative of continuing to do so in the coming years.

Regional Segmentation and Analysis:

The markets in the Asia Pacific region accounted for the majority number of revenue shares of the global dicing blade market in 2020, and is anticipated to remain this market’s front-runner for the remainder of this forecast period. The markets in North America accounted for a considerable number of revenue shares in 2020, and is anticipated to continue to do so in the years to come.

Segmentation of the Global Dicing Blade Market:

Segmentation by Product Type:

• Hub Dicing Blades
• Hubless Dicing Blades
• Other Products

Segmentation by Application:

• Semiconductors
• Ceramics
• Glass
• Other Applications

Segmentation by Region:

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

 Key players profiled in the market report are:

• Disco Corporation
• Advanced Dicing Technologies Ltd. (ADT)
• Kulicke and Soffa Industries Inc.
• UKAM Industrial Superhard Tools
• Ceiba Technologies Inc.

For the Dicing Blade Market research study, the following years have been considered to estimate the market size: