Global Die Attach Machine Market By Type (Die Bonder, Flip Chip Bonder), By Application (RF & MEMS, Optoelectronics, Logic, Memory, CMOS Image Sensors), By Region, and Key Companies - Industry Segment Outlook, Market Assessment, Competition Scenario, Trends and Forecast 2021-2031

Die attach machines, also known as die bond machines, and are used to attach a silicon chip to a die cavity or die pad of the support structure of a semiconductor package. This process is done by two methods namely, eutectic die attach, and adhesive die attach.

Eutectic die attach is typically a highly controlled die attach process for high-accuracy requirements and high-reliability devices. Applications used for eutectic die attach include military hybrids, RF power amplifiers, high power semiconductor modules, MMICs, and laser pump diodes. Die attach machines are employed in various industry verticals for several applications such as RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, and LED, among others.

Several semiconductors & optoelectronic packaging companies require fully automated, high-precision die bonders, such as eutectic die bonding, epoxy die attach, and thermo-compression. End-users are scaling-up their respective manufacturing capacities in order to meet the increasing demand from businesses, driven by data-center applications, telecommunication upgrades to 100G+, 5G wireless technology, and advanced optical sensors, among other areas of application.

In recent times, high volume manufacturing of sensors, photonic, and semiconductor devices require an automatic die bonding system that can easily deliver industry leading throughput with superior flexibility and high levels of precision. These aforementioned parameters are anticipated to bolster the revenue growth of the global die attach machine market.

Detailed Segmentation:

The global die attach machine market is segmented on the basis of type, application, and region. A detailed segmental description is listed below:

Based on Type

• Die Bonder
• Flip Chip Bonder

Based on Application

• RF & MEMS
• Optoelectronics
• Logic
• Memory
• CMOS Image Sensors
• Other Applications

Based on Region

• North America
• Europe
• Asia-Pacific
• South America
• Middle East and Africa

Market Dynamics

The increasing adoption rates of electronic products among end-users have led to an increase in the demand for chips, electric circuit boards, etc. This in turn, is anticipated to propel the revenue growth of the die attach machine market over the forecast period. Additionally, stringent government regulations pertaining to workplace safety is also another factor that is anticipated to bolster the demand for die attach machines from various end-use industries.

A steady surge in the demand for hybrid circuits in medical equipment, owing to the increase in the number of patients is creating exponential demand for semiconductor chips. In addition to this, the increasing number of user-friendly electronic items, as well as a continually developing residential sector, have also created immense demand for consumer electronics across the globe. These aforementioned factors are expected to augment projected revenues for the global die attach machines market over the forecast period.

However, fluctuating prices of raw materials are slated to restrain potential opportunities for the global die attach machine market to a certain extent.  Moreover, consistent growth in the GDP of both developed and developing nations has also aided in the evolution of various end-use industries. Owing to this growth in the GDP of emerging countries, prominent market players have exhibited a keen sense of interest towards these regions, thereby complementing revenue expansion prospects for the global die attach machine market.

Due to the COVID-19 pandemic, several countries have imposed complete lockdowns, which in turn, has negatively impacted their respective manufacturing sectors. Manufacturing units across the globe were shut down, and vehicle sales drastically decreased. This in turn, is likely to impact market growth opportunities to a certain extent. Moreover, increasing demographic dividends, surging per capita disposable incomes, and higher industrialization levels are also crucial elements that are slated to increase both the demand & supply of die attach machines, which are also prominent elements anticipated to impact this industry in a positive manner.

For instance, as per the US Bureau of Labor Statistics (BLS), there has been an increase in the personal disposable incomes of the US population. It increased from USD 11,394 Bn in 2006 to USD 15,928.7 Bn in 2016 and is expected to reach USD 24,174.5 Bn by 2024.

Competitive Landscape:

• Anza Technology Inc.
• ASM Pacific Technology Limited
• BE Semiconductor Industries N.V.
• Fasford Technology Co. Limited
• Inseto UK Limited
• Kulicke and Soffa Industries Inc.
• MicroAssembly Technologies Limited
• Palomar Technologies
• Shinkawa Limited.
• among others

These aforementioned companies develop new products/services, adopt expansion strategies, and undertake partnerships, collaborations, and mergers & acquisitions to gain traction in the global die attach machine market.

Key Developments:

• ASM Pacific Technology has recently introduced Automatic Die Attach System (AD838L-G2) that has an accuracy of upto ± 10 µm, dual epoxy stamping/dispensing process, direct ceramic substrate indexing, and material traceability capability. This system is suitable for CSP-LED applications.
• Anza Technology Inc. revealed its (Anza Model 270) automated thermosonic die attach machine. This machine uses ultrasonics with heat to improve reliability.

For the Die Attach Machine Market research study, the following years have been considered to estimate the market size: