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Multilayer Printed-wiring Board Market
Published date: Nov 2021 •Formats:
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Global Multilayer Printed-wiring Board Market By Type (Layer 4~6 , Layer 8~10 , and Layer 10+), By Application (Consumer electronics , Communications , Computer related industry , and Automotive industry), By Region and Key Companies - Industry Segment Outlook, Market Assessment, Competition Scenario, Trends and Forecast 2019–2028

  • Published date: Nov 2021
  • Report ID: 15580
  • Number of Pages: 334
  • Format:
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    • 1. Multilayer Printed-wiring Board Market Introduction
      • 1.1. Definition
      • 1.2. Taxonomy
      • 1.3. Research Scope
    • 2. Executive Summary
      • 2.1. Key Findings by Major Segments
      • 2.2. Top strategies by Major Players
    • 3. Global Multilayer Printed-wiring Board Market Overview
      • 3.1. Multilayer Printed-wiring Board Market Dynamics
        • 3.1.1. Drivers
        • 3.1.2. Opportunities
        • 3.1.3. Restraints
        • 3.1.4. Challenges
      • 3.2. PESTLE Analysis
      • 3.3. Opportunity Map Analysis
      • 3.4. PORTER'S Five Forces Analysis
      • 3.5. Market Competition Scenario Analysis
      • 3.6. Product Life Cycle Analysis
      • 3.7. Opportunity Orbits
      • 3.8. Manufacturer Intensity Map
    • 4. Global Multilayer Printed-wiring Board Market Value (US$ Mn), Share (%), and Growth Rate (%) Comparison by Type, 2012-2028
      • 4.1. Global Multilayer Printed-wiring Board Market Analysis by Type: Introduction
      • 4.2. Market Size and Forecast by Region
      • 4.3. Layer 4~6
      • 4.4. Layer 8~10
      • 4.5. Layer 10+
    • 5. Global Multilayer Printed-wiring Board Market Value (US$ Mn), Share (%), and Growth Rate (%) Comparison by Application, 2012-2028
      • 5.1. Global Multilayer Printed-wiring Board Market Analysis by Application: Introduction
      • 5.2. Market Size and Forecast by Region
      • 5.3. Consumer electronics
      • 5.4. Communications
      • 5.5. Computer related industry
      • 5.6. Automotive industry
    • 6. Global Multilayer Printed-wiring Board Market Value (US$ Mn), Share (%), and Growth Rate (%) Comparison by Region, 2012-2028
      • 6.1. North America
        • 6.1.1. North America Multilayer Printed-wiring Board Market: Regional Trend Analysis
          • 6.1.1.1. US
          • 6.1.1.2. Canada
          • 6.1.1.3. Mexico
      • 6.2. Europe
        • 6.2.1. Europe Multilayer Printed-wiring Board Market: Regional Trend Analysis
          • 6.2.1.1. Germany
          • 6.2.1.2. France
          • 6.2.1.3. UK
          • 6.2.1.4. Russia
          • 6.2.1.5. Italy
          • 6.2.1.6. Rest of Europe
      • 6.3. Asia-Pacific
        • 6.3.1. Asia-Pacific Multilayer Printed-wiring Board Market: Regional Trend Analysis
          • 6.3.1.1. China
          • 6.3.1.2. Japan
          • 6.3.1.3. Korea
          • 6.3.1.4. India
          • 6.3.1.5. Rest of Asia
      • 6.4. Latin America
        • 6.4.1. Latin America Multilayer Printed-wiring Board Market: Regional Trend Analysis
          • 6.4.1.1. Brazil
          • 6.4.1.2. Argentina
          • 6.4.1.3. Rest of Latin America
      • 6.5. Middle East and Africa
        • 6.5.1. Middle East and Africa Multilayer Printed-wiring Board Market: Regional Trend Analysis
          • 6.5.1.1. GCC
          • 6.5.1.2. South Africa
          • 6.5.1.3. Israel
          • 6.5.1.4. Rest of MEA
    • 7. Global Multilayer Printed-wiring Board Market Competitive Landscape, Market Share Analysis, and Company Profiles
      • 7.1. Market Share Analysis
      • 7.2. Company Profiles
      • 7.3. Nippon Mektron
        • 7.3.1. Company Overview
        • 7.3.2. Financial Highlights
        • 7.3.3. Product Portfolio
        • 7.3.4. SWOT Analysis
        • 7.3.5. Key Strategies and Developments
      • 7.4. Zhen Ding Technology
        • 7.4.1. Company Overview
        • 7.4.2. Financial Highlights
        • 7.4.3. Product Portfolio
        • 7.4.4. SWOT Analysis
        • 7.4.5. Key Strategies and Developments
      • 7.5. Unimicron
        • 7.5.1. Company Overview
        • 7.5.2. Financial Highlights
        • 7.5.3. Product Portfolio
        • 7.5.4. SWOT Analysis
        • 7.5.5. Key Strategies and Developments
      • 7.6. Young Poong Group
        • 7.6.1. Company Overview
        • 7.6.2. Financial Highlights
        • 7.6.3. Product Portfolio
        • 7.6.4. SWOT Analysis
        • 7.6.5. Key Strategies and Developments
      • 7.7. Samsung Electro-Mechanics
        • 7.7.1. Company Overview
        • 7.7.2. Financial Highlights
        • 7.7.3. Product Portfolio
        • 7.7.4. SWOT Analysis
        • 7.7.5. Key Strategies and Developments
      • 7.8. Ibiden
        • 7.8.1. Company Overview
        • 7.8.2. Financial Highlights
        • 7.8.3. Product Portfolio
        • 7.8.4. SWOT Analysis
        • 7.8.5. Key Strategies and Developments
      • 7.9. Tripod
        • 7.9.1. Company Overview
        • 7.9.2. Financial Highlights
        • 7.9.3. Product Portfolio
        • 7.9.4. SWOT Analysis
        • 7.9.5. Key Strategies and Developments
      • 7.10. TTM Technologies
        • 7.10.1. Company Overview
        • 7.10.2. Financial Highlights
        • 7.10.3. Product Portfolio
        • 7.10.4. SWOT Analysis
        • 7.10.5. Key Strategies and Developments
      • 7.11. Sumitomo Electric SEI
        • 7.11.1. Company Overview
        • 7.11.2. Financial Highlights
        • 7.11.3. Product Portfolio
        • 7.11.4. SWOT Analysis
        • 7.11.5. Key Strategies and Developments
      • 7.12. Daeduck Group
        • 7.12.1. Company Overview
        • 7.12.2. Financial Highlights
        • 7.12.3. Product Portfolio
        • 7.12.4. SWOT Analysis
        • 7.12.5. Key Strategies and Developments
      • 7.13. Nanya PCB
        • 7.13.1. Company Overview
        • 7.13.2. Financial Highlights
        • 7.13.3. Product Portfolio
        • 7.13.4. SWOT Analysis
        • 7.13.5. Key Strategies and Developments
      • 7.14. Compeq
        • 7.14.1. Company Overview
        • 7.14.2. Financial Highlights
        • 7.14.3. Product Portfolio
        • 7.14.4. SWOT Analysis
        • 7.14.5. Key Strategies and Developments
      • 7.15. HannStar Board
        • 7.15.1. Company Overview
        • 7.15.2. Financial Highlights
        • 7.15.3. Product Portfolio
        • 7.15.4. SWOT Analysis
        • 7.15.5. Key Strategies and Developments
      • 7.16. LG Innotek
        • 7.16.1. Company Overview
        • 7.16.2. Financial Highlights
        • 7.16.3. Product Portfolio
        • 7.16.4. SWOT Analysis
        • 7.16.5. Key Strategies and Developments
      • 7.17. AT&S
        • 7.17.1. Company Overview
        • 7.17.2. Financial Highlights
        • 7.17.3. Product Portfolio
        • 7.17.4. SWOT Analysis
        • 7.17.5. Key Strategies and Developments
      • 7.18. Meiko
        • 7.18.1. Company Overview
        • 7.18.2. Financial Highlights
        • 7.18.3. Product Portfolio
        • 7.18.4. SWOT Analysis
        • 7.18.5. Key Strategies and Developments
      • 7.19. Chin-Poon
        • 7.19.1. Company Overview
        • 7.19.2. Financial Highlights
        • 7.19.3. Product Portfolio
        • 7.19.4. SWOT Analysis
        • 7.19.5. Key Strategies and Developments
      • 7.20. Shennan
        • 7.20.1. Company Overview
        • 7.20.2. Financial Highlights
        • 7.20.3. Product Portfolio
        • 7.20.4. SWOT Analysis
        • 7.20.5. Key Strategies and Developments
      • 7.21. WUS
        • 7.21.1. Company Overview
        • 7.21.2. Financial Highlights
        • 7.21.3. Product Portfolio
        • 7.21.4. SWOT Analysis
        • 7.21.5. Key Strategies and Developments
    • 8. Assumptions and Acronyms
    • 9. Research Methodology
    • 10. Contact
    • Nippon Mektron
    • Zhen Ding Technology
    • Unimicron
    • Young Poong Group
    • Samsung Electro-Mechanics
    • Ibiden
    • Tripod
    • TTM Technologies
    • Sumitomo Electric SEI
    • Daeduck Group
    • Nanya PCB
    • Compeq
    • HannStar Board
    • LG Innotek
    • AT&S
    • Meiko
    • Chin-Poon
    • Shennan
    • WUS
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