Global Radiation-Hardened Electronic Components Market By Type (Silicon, Silicon Carbide, Gallium Nitride, Others), By Application (Aerospace and Defense, Medical, Consumer Electronics, Industrial, Others), By Region and Key Companies - Industry Segment Outlook, Market Assessment, Competition Scenario, Trends and Forecast 2019–2028

Published date: Apr 2022
Report ID: 26304
Number of Pages: 309
Format:

- 1. Global Radiation-Hardened Electronic Components Market Introduction
  - 1.1. Definition
  - 1.2. Taxonomy
  - 1.3. Research Scope
- 2. Executive Summary
  - 2.1. Key Findings by Major Segments
  - 2.2. Top strategies by Major Players
- 3. Global Radiation-Hardened Electronic Components Market Overview
  - 3.1. Global Radiation-Hardened Electronic Components Market Dynamics
    3.1.1. Drivers
    3.1.2. Opportunities
    3.1.3. Restraints
    3.1.4. Challenges
  - 3.2. PESTLE Analysis
  - 3.3. Opportunity Map Analysis
  - 3.4. PORTER'S Five Forces Analysis
  - 3.5. Market Competition Scenario Analysis
  - 3.6. Product Life Cycle Analysis
  - 3.7. Opportunity Orbits
  - 3.8. Manufacturer Intensity Map
- 4. Global Radiation-Hardened Electronic Components Market Value ((US$ Mn)), Share (%), and Growth Rate (%) Comparison by Type, 2012-2028
  - 4.1. Global Radiation-Hardened Electronic Components Market Analysis by Type: Introduction
  - 4.2. Market Size and Forecast by Region
  - 4.3. Silicon
  - 4.4. Silicon Carbide
  - 4.5. Gallium Nitride
  - 4.6. Others
- 5. Global Radiation-Hardened Electronic Components Market Value ((US$ Mn)), Share (%), and Growth Rate (%) Comparison by Application, 2012-2028
  - 5.1. Global Radiation-Hardened Electronic Components Market Analysis by Application: Introduction
  - 5.2. Market Size and Forecast by Region
  - 5.3. Aerospace and Defense
  - 5.4. Medical
  - 5.5. Consumer Electronics
  - 5.6. Industrial
  - 5.7. Others
- 6. Global Radiation-Hardened Electronic Components Market Value ((US$ Mn)), Share (%), and Growth Rate (%) Comparison by Region, 2012-2028
  - 6.1. North America
    6.1.1. North America Global Radiation-Hardened Electronic Components Market: Regional Trend Analysis
    6.1.1.1. US
    6.1.1.2. Canada
    6.1.1.3. Mexico
  - 6.2.1. Europe
    6.2.1. Europe Global Radiation-Hardened Electronic Components Market: Regional Trend Analysis
    6.2.1.1. Germany
    6.2.1.2. France
    6.2.1.3. UK
    6.2.1.4. Russia
    6.2.1.5. Italy
    6.2.1.6. Rest of Europe
  - 6.3. Asia-Pacific
    6.3.1. Asia-Pacific Global Radiation-Hardened Electronic Components Market: Regional Trend Analysis
    6.3.1.1. China
    6.3.1.2. Japan
    6.3.1.3. Korea
    6.3.1.4. India
    6.3.1.5. Rest of Asia
  - 6.4. Latin America
    6.4.1. Latin America Global Radiation-Hardened Electronic Components Market: Regional Trend Analysis
    6.4.1.1. Brazil
    6.4.1.2. Argentina
    6.4.1.3. Rest of Latin America
  - 6.5. Middle East and Africa
    6.5.1. Middle East and Africa Global Radiation-Hardened Electronic Components Market: Regional Trend Analysis
    6.5.1.1. GCC
    6.5.1.2. South Africa
    6.5.1.3. Israel
    6.5.1.4. Rest of MEA
- 7. Global Radiation-Hardened Electronic Components Market Competitive Landscape, Market Share Analysis, and Company Profiles
  - 7.1. Market Share Analysis
  - 7.2. Company Profiles
  - 7.3.
    7.3.1. Company Overview
    7.3.2. Financial Highlights
    7.3. 3. Product Portfolio
    7.3.4. SWOT Analysis
    7.3.5. Key Strategies and Developments
  - 7.4. Honeywell International
    7.4.1. Company Overview
    7.4.2. Financial Highlights
    7.4.3. Product Portfolio
    7.4. 4. SWOT Analysis
    7.4.5. Key Strategies and Developments
  - 7.5. BAE Systems
    7.5.1. Company Overview
    7.5.2. Financial Highlights
    7.5.3. Product Portfolio
    7.5.4. SWOT Analysis
    7.5. 5. Key Strategies and Developments
  - 7.6. Analog Devices
    7.6.1. Company Overview
    7.6.2. Financial Highlights
    7.6.3. Product Portfolio
    7.6.4. SWOT Analysis
    7.6.5. Key Strategies and Developments
  - 7.7. Texas Instruments
    7.7.1. Company Overview
    7.7.2. Financial Highlights
    7.7.3. Product Portfolio
    7.7.4. SWOT Analysis
    7.7.5. Key Strategies and Developments
  - 7.8. Atmel
    7.8.1. Company Overview
    7.8.2. Financial Highlights
    7.8.3. Product Portfolio
    7.8.4. SWOT Analysis
    7.8.5. Key Strategies and Developments
  - 7.9. Renesas Electronics
    7.9.1. Company Overview
    7.9.2. Financial Highlights
    7.9.3. Product Portfolio
    7.9.4. SWOT Analysis
    7.9.5. Key Strategies and Developments
  - 7. 10.STMicroelectronics
    7. 10.1. Company Overview
    7. 10.2. Financial Highlights
    7. 10.3. Product Portfolio
    7. 10.4. SWOT Analysis
    7. 10.5. Key Strategies and Developments
  - 7. 11. Microsemi
    7. 11.1. Company Overview
    7. 11.2. Financial Highlights
    7. 11.3. Product Portfolio
    7. 11.4. SWOT Analysis
    7. 11.5. Key Strategies and Developments
  - 7. 12. Xilinx
    7. 12.1. Company Overview
    7. 12.2. Financial Highlights
    7. 12.3. Product Portfolio
    7. 12.4. SWOT Analysis
    7. 12.5. Key Strategies and Developments
  - 7. 13. Cobham
    7. 13.1. Company Overview
    7. 13.2. Financial Highlights
    7. 13.3. Product Portfolio
    7. 13.4. SWOT Analysis
    7. 13.5. Key Strategies and Developments
  - 7. 14. VPT
    7. 14.1. Company Overview
    7. 14.2. Financial Highlights
    7. 14.3. Product Portfolio
    7. 14.4. SWOT Analysis
    7. 14.5. Key Strategies and Developments
  - 7. 15. Data Device Corporation (DDC)
    7. 15.1. Company Overview
    7. 15.2. Financial Highlights
    7. 15.3. Product Portfolio
    7. 15.4. SWOT Analysis
    7. 15.5. Key Strategies and Developments
  - 7. 16. Intersil
    7. 16.1. Company Overview
    7. 16.2. Financial Highlights
    7. 16.3. Product Portfolio
    7. 16.4. SWOT Analysis
    7. 16.5. Key Strategies and Developments
  - 7. 17. Maxwell Technologies
    7. 17.1. Company Overview
    7. 17.2. Financial Highlights
    7. 17.3. Product Portfolio
    7. 17.4. SWOT Analysis
    7. 17.5. Key Strategies and Developments
- 8. Assumptions and Acronyms
- 9. Research Methodology
- 10.Contact
- Honeywell International, Inc. Company Profile
- BAE Systems Plc Company Profile
- Analog Devices
- Texas Instruments
- Atmel
- Renesas Electronics
- STMicroelectronics
- Microchip Technology Inc. Company Profile
- Xilinx
- Cobham
- VPT
- Data Device Corporation (DDC)
- Intersil
- Maxwell Technologies
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